PART |
Description |
Maker |
HN7G02FU |
TOSHIBA Multi Chip Discrete Device
|
TOSHIBA[Toshiba Semiconductor]
|
SSM6E03TU |
Multi-chip discrete device (P-ch N-ch)
|
TOSHIBA
|
HN2E04F |
Multi-chip discrete device (PNP SW diode)
|
TOSHIBA
|
TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
TPCP8H02 |
TOSHIBA Multi-Chip Transistor Silicon NPN Epitaxial Type, Field Effect Transistor Silicon N Channel MOS Type
|
Toshiba Semiconductor
|
CYM1841APR-20C CYM1841BPZ-25C CYM1841APY-20C CYM18 |
x32 SRAM Module X32号的SRAM模块 256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72 256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72 PLASTIC, SIMM-72 256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72 256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72 PLASTIC, SIMM-72 256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZMA64 PLASTIC, ZIP-64
|
Cypress Semiconductor, Corp. Everlight Electronics Co., Ltd. Pyramid Semiconductor, Corp. YEONHO Electronics Co., Ltd.
|
OP950 |
PIN Sili con Pho todiode
|
OPTEK[OPTEK Technologies] ETC
|
OP905 |
PIN Sili con Pho todiode
|
OPTEK[OPTEK Technologies]
|
OP955 |
PIN Sili con Pho todiode
|
Optek Technology ETC OPTEK[OPTEK Technologies]
|
CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20 IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感 Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc. Bourns, Inc.
|
CYM1841BPZ-20C CYM1841BPZ-45C CYM1841BP7-15C CYM18 |
256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, SMA72 PLASTIC, SIMM-72 256K x 32 Static RAM Module
|
Cypress Semiconductor, Corp.
|
|